Laatste nieuws in general

SEMICON Taiwan 2025 Unveils Breakthroughs in AI-Powered Semiconductor Packaging
Hsinchu, Friday, 15 August 2025.
The SEMICON Taiwan 2025 event in Hsinchu highlighted advanced semiconductor packaging technologies crucial to AI and HPC, with methods like 3DIC and chiplet architectures gaining prominence as Moore’s Law slows.

Daiichi Faces Profit Decline While Via HD Reports Modest Profit Increase in Q2 2025
Tokyo, Tuesday, 12 August 2025.
Daiichi’s profit post-tax fell 26% amid rising costs, while Via HD’s profit rose 1% due to strategic menu updates and product quality improvements, reflecting diverse challenges in Japan’s sectors.

Japan Launches Apprenticeship Programs to Bolster Semiconductor Workforce
Tokyo, Monday, 11 August 2025.
In response to a significant skills gap in its semiconductor industry, Japan has introduced apprenticeship programs. These aim to equip new workers with essential skills amid rising global semiconductor demand.