SEMICON Taiwan 2025 Unveils Breakthroughs in AI-Powered Semiconductor Packaging
Hsinchu, Friday, 15 August 2025.
The SEMICON Taiwan 2025 event in Hsinchu highlighted advanced semiconductor packaging technologies crucial to AI and HPC, with methods like 3DIC and chiplet architectures gaining prominence as Moore’s Law slows.
Innovative Semiconductor Packaging Shapes Future
At the core of SEMICON Taiwan 2025’s showcase were the groundbreaking advancements in semiconductor packaging, including 3D Integrated Circuits (3DIC), Fan-Out Panel Level Packaging (FOPLP), and chiplet technologies. These innovations signal a shift in the industry as the scalability of traditional semiconductor processes, encapsulated by Moore’s Law, faces significant hurdles. The event, held in Hsinchu, Taiwan, underscored the importance of these technologies to meet the rising demand for AI and High-Performance Computing (HPC) applications [1].
3DIC and Fan-Out Technologies in the Spotlight
The adoption of 3DIC and FOPLP technologies is paramount as they provide efficient solutions to enhance performance and reduce the size of semiconductor devices. These packaging methods allow for enhanced integration, which is crucial for supporting the growth of AI applications that require immense computational power and memory bandwidth [1]. The global spotlight on these technologies was further reinforced with dedicated forums such as the 3DIC Global Summit and FOPLP Innovation Forum, hosted during the event [1].
Global Collaboration and Industry Participation
Significant industry participation marked the SEMICON Taiwan 2025 event, with key players like ASE, Broadcom, and TSMC displaying their latest applications in advanced semiconductor packaging. The establishment of the 3DIC Advanced Manufacturing Alliance (3DICAMA) by SEMI was also announced, aimed at fostering global collaboration and next-generation system integration strategies [1]. Terry Tsao, Global Chief Marketing Officer and President of Taiwan at SEMI, emphasized that the sector’s manufacturing capacity is expected to reach 1.4 million wafers per month by 2028, underscoring the industry’s robust growth trajectory [1].
Implications for Asia and Global Markets
The significance of the SEMICON Taiwan 2025 event extends beyond Taiwan, impacting the broader Asian and global markets. The focus on innovative packaging solutions aligns with trends in the Netherlands and other regions looking to capitalize on these advancements for their semiconductor industries [alert! ‘link to Dutch advancements not explicitly stated in the source’]. This event illustrates the dynamic nature of collaboration across continents that is pivotal for sustaining industry growth in the face of evolving technological requirements [2].