Silicone Material Breakthroughs Advance Foldable Electronics Tech
Seoul, Wednesday, 13 August 2025.
Recent advancements in silicone poly(urea oxamide)-based clear viscoelastic films improve elasticity, thermal stability, and adhesion in foldable electronics, addressing key manufacturing challenges.
Revolution in Foldable Electronics
The recent advancements in silicone poly(urea oxamide)-based clear viscoelastic films (CVFs) signify a major leap forward in the foldable electronics sector. These materials, which have been developed using a room-temperature fabrication process, showcase remarkable improvements in elasticity, thermal stability, and adhesion. This development is pivotal as it addresses the significant challenges in manufacturing foldable electronic devices, which require materials that maintain structural integrity over repeated use without compromising performance [1].
Innovative Material Properties
The new CVFs have been engineered to exhibit an exceptional glass transition temperature (Tg) of -46.1°C and a peel force of 7.93 N per 25 mm. Such qualities indicate superior adhesive properties and robustness. Coupled with a stress relaxation ratio of 82.1% and a notable stretchability of 3300%, these advancements ensure the materials can endure the demands of foldable electronic applications. Furthermore, the creep recovery ratio of 85.2% further highlights the material’s ability to revert to its original form after deformation, a critical feature for long-term use in flexible devices [1].
Research Origins and Global Impact
The research underpinning these advancements was conducted by a team from the South China University of Technology (SCUT) in Guangzhou, China. Their innovative approach modifies the formulations of silicone poly(urea oxamide)s (SPUOs), achieving a synergy of strong and weak hydrogen bonds to create a material suitable for advanced electronic applications. This development is expected to influence technological advancements globally, especially in Asia, where the demand for flexible electronics continues to grow, notably in countries such as South Korea and Japan [1].
Future Prospects
As the electronics industry continues to trend towards miniaturization and flexibility, the development of such advanced silicone materials is timely. It supports sustainable manufacturing processes and the ever-growing push for more efficient electronic components. Researchers involved in this breakthrough project anticipate further innovations in this field to continue refining the balance of material properties needed for next-generation foldable devices, potentially revolutionizing how we perceive and use electronics in daily life [1][2].