Pragmatic Semiconductor Boosts Sustainable NFC Adoption with Flexible Chips in Singapore
Singapore, Thursday, 27 March 2025.
Pragmatic Semiconductor’s NFC Connect innovation in Singapore is expanding market opportunities for intelligent systems with sustainable flexible chips, promoting eco-friendly edge computing and IoT integration.
Revolutionary Flexible Chip Technology
Pragmatic Semiconductor’s latest innovation introduces the NFC Connect product line, featuring ultra-thin flexible chips that are revolutionizing item-level intelligence and edge computing [1]. The technology employs FlexIC technology, producing semiconductor chips thinner than a human hair, enabling seamless integration even on curved surfaces [2]. With manufacturing based at Pragmatic Park in Durham, UK - the country’s first 300mm semiconductor fabrication line - the facility boasts an annual production capacity of billions of chips [1].
Market Growth and Environmental Impact
The timing of this innovation is significant, as the Printed and Chipless RFID market is projected to grow from USD 5.66 billion in 2023 to USD 32.21 billion by 2032, demonstrating a CAGR of 21.37 percent [3]. The technology addresses critical sustainability concerns, with manufacturing processes that significantly reduce energy consumption, water usage, and harmful chemical exposure compared to traditional semiconductor production methods [1]. This environmental consciousness aligns with growing market demands for sustainable technology solutions.
Industry Integration and Applications
The NFC Connect system is fully compatible with iOS and Android devices, conforming to ISO15693 and NFC Forum Type 5 industry standards [4]. This versatility enables widespread adoption across various sectors, including food and beverage, apparel, pharmaceuticals, and cosmetics [1]. Major industry players have already shown strong interest, with Avery Dennison, a global materials and digital identification solutions provider, becoming a strategic investor in the technology [1].
Future Outlook
The technology’s launch marks a significant milestone in sustainable semiconductor manufacturing, with the initial product PR1301 now available as frame-mounted 300mm wafers and singulated dies [1]. As the printed and chipless RFID sector continues its rapid expansion [3], Pragmatic’s innovation positions the company at the forefront of next-generation smart packaging and item-level intelligence solutions [1][3].